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name: HV-Interfaceboard
size: 106*70*1.6mm
designrules:
copper:
min. spacing: 0.2mm
min. trace width: 0.2mm
min. connection width: 0.1mm
via diameter: 0.8mm
Cu-to-hole spacing: 0.25mm
Cu-to-edge spacing: 0.5mm
holes:
min. hole: 0.4mm
hole-to-hole spacing: 0.25mm
mask:
solderingmask extension: 0.08mm
layers: 4 layers
material: FR4
surface: HAL leadfree
gerberfile description:
HV-Interfaceboard-F_Cu.gbr --> 1st layer; Signal and Return
HV-Interfaceboard-Power_Cu.gbr --> 2nd layer; Power distribution
HV-Interfaceboard-Chassis_Cu.gbr --> 3rd layer; Chassis GND plane
HV-Interfaceboard-B_Cu.gbr --> 4th layer; Signal
HV-Interfaceboard-F_Mask.gbr --> Front solderingmask
HV-Interfaceboard-B_Mask.gbr --> Back solderingmask
HV-Interfaceboard-PTH.drl --> Plated Through-Holes
HV-Interfaceboard-Edge_Cuts.gbr --> Edge Cuts